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pc8141xnsz0f series 1. recognized by ul1577 (double protection isolation), file no. e64380 (as model no. pc8141 ) 2. package resin : ul flammability grade (94v-0) features agency approvals/compliance 1. programmable controllers 2. facsimiles 3. telephones applications dip 4pin high cmr, ac input, low input current photocoupler 1. 4-pin dip package 2. double transfer mold package (ideal for flow solder- ing) 3. ac input type 4. low input current type (i f = 0.5ma) 5. high collector-emitter voltage (v ceo : 80v) 6. high noise immunity due to high common rejection voltage (cmr : min. 10kv/ s) 7. high isolation voltage between input and output (v iso(rms) : 5.0 kv) 8. lead-free and rohs directive compliant description pc8141xnsz0f series contains an ired optically coupled to a phototransistor. it is packaged in a 4-pin dip, available in smt gullw- ing lead-form option. input-output isolation voltage(rms) is 5.0kv. collector-emitter voltage is 80v , ctr is 50% to 600% at input current of 0.5ma and cmr is min. 10kv/ s. 1 sheet no.: d2-a03702en date jun. 30. 2005 ?sharp corporation notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification sheets before usin g any sharp device. pc8141xnsz0f series
internal connection diagram anode/cathode cathode/anode emitter collector 1 1 2 3 4 2 4 3 2 sheet no.: d2-a03702en outline dimensions (unit : mm) 1. through-hole [ex. pc8141xnsz0f ] 2. smt gullwing lead-form [ex. pc8141xniz0f ] plating material : sncu (cu : typ. 2%) product mass : approx. 0.22g product mass : approx. 0.23g 6.5 0.5 7.62 0.3 4.58 0.5 : 0 to 13? epoxy resin 0.26 0.1 3.5 0.5 3.0 0.5 0.5 typ. 0.6 0.2 1.2 0.3 1 2 4.58 0.5 2.54 0.25 4 3 primary side mark rank mark factory identification mark date code 8141 2.7 0.5 0.5 0.1 0.6 0.2 1.2 0.3 6.5 0.5 7.62 0.3 0.26 0.1 4.58 0.5 2.54 0.25 epoxy resin 3.5 0.5 4.58 0.5 2.54 0.25 4 3 rank mark factory identification mark 1.0 + 0.4 ? 0 1.0 + 0.4 ? 0 10.0 + 0 ? 0.5 0.35 0.25 1 2 primary side mark date code 8141 pc8141xnsz0f series
a.d. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 mark a b c d e f h j k l m n mark p r s t u v w x a b c mark 1 2 3 4 5 6 7 8 9 o n d month january february march april may june july august september october november december a.d 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2nd digit month of production 1st digit year of production factory identification mark factory identification mark no mark country of origin japan indonesia china * this factory making is for identification purpose only. please contact the local sharp sales representative to see the actual status of the production. 3 repeats in a 20 year cycle sheet no.: d2-a03702en pc8141xnsz0f series date code (2 digit) rank mark refer to the model line-up table
sheet no.: d2-a03702en electro-optical characteristics parameter conditions forward voltage terminal capacitance collector dark current collector-emitter breakdown voltage transfer charac- teristics collector current collector-emitter saturation voltage emitter-collector breakdown voltage isolation resistance floating capacitance min. ? ? ? 80 0.25 ? 5 10 10 ? ? 10 typ. 1.2 30 ? ? ? ? ? 1 10 11 0.6 3 ? max. 1.4 250 100 ? 2.0 ? 0.2 ? 1.0 18 ? unit v v pf na v ma v ? s s kv/ s symbol v f c t i ceo bv ceo bv eco i c v ce (sat) r iso t f cmr c f response time common mode rejection voltage rise time fall time input output i f = 10ma v = 0, f = 1khz v ce = 50v, i f = 0 i c = 0.1ma, i f = 0 i e = 10 a, i f = 0 i f = 0.5ma, v ce = 5v dc500v, 40 to 60%rh t a = 25 ?c , r l = 470 ? , v cm = 1.5kv(peak) i f = 0, v cc = 9v, v np = 100mv v ce = 2v, i c = 2ma, r l = 100 ? ? 418 pf t r v = 0, f = 1mhz i f = 10ma, i c = 1ma 6 (t a = 25?c) absolute maximum ratings (t a = 25?c) parameter symbol unit input forward current ma *1 peak forward current ma power dissipation mw output collector-emitter voltage v emitter-collector voltage v collector current ma collector power dissipation mw total power dissipation mw *2 isolation voltage operating temperature ?c storage temperature ?c *3 soldering temperature i f i fm p v ceo v eco i c p c p tot v iso (rms) t opr t stg t sol ?c *1 pulse width 100 s, duty ratio : 0.001 *2 40 to 60%rh, ac for 1 minute, f=60hz *3 for 10s rating 10 200 15 80 6 50 150 170 ? 30 to + 100 ? 55 to + 125 260 5.0 kv 4 pc8141xnsz0f series
sheet no.: d2-a03702en model line-up i c [ma] (i f = 0.5ma, v ce = 5v, t a = 25?c) lead form package rank mark with or without a 0.25 to 2.0 0.5 to 1.5 PC81410NSZ0F pc81411nsz0f through-hole pc81410niz0f pc81411niz0f smt gullwing pc81410nip0f pc81411nip0f sleeve 100pcs/sleeve taping 3 000pcs/reel model no. 5 please contact a local sharp sales representative to inquire about production status. pc8141xnsz0f series
sheet no.: d2-a03702en total power dissipation p tot (mw) ambient temperature t a (?c) 0 250 200 150 170 100 50 ? 30 0 25 50 75 100 125 fig.5 total power dissipation vs. ambient temperature forward current i f (ma) ambient temperature t a (?c) 0 15 10 5 ? 30 0 25 50 75 100 125 fig.2 forward current vs. ambient temperature diode power dissipation p (mw) ambient temperature t a (?c) 0 15 10 5 ? 30 0 25 50 75 100 125 fig.3 diode power dissipation vs. ambient temperature collector power dissipation p c (mw) ambient temperature t a (?c) 0 250 200 150 100 50 ? 30 0 25 50 75 100 125 fig.4 collector power dissipation vs. ambient temperature 6 fig.1 test circuit for common mode rejection voltage v cm v cp v np v o (dv/d t ) * r l v np v cc v cm (v cp nearly = dv/d t c f r l ) * v cp : voltage which is generated by displacement current in floating capacitance between primary and secondary side. v cm : high wave pulse r l = 470 ? v cc = 9v ? ? ? ? ? pc8141xnsz0f series
sheet no.: d2-a03702en relative current transfer ratio (%) ambient temperature t a (?c) ? 30 100 90 80 70 60 50 40 30 20 10 0 ? 10 ? 20 v ce = 5v i f = 0.5ma 0 150 100 50 fig.10 relative current transfer ratio vs. ambient temperature collector-emitter saturation voltage v ce (sat) (v) ambient temperature t a (?c) 0 0.16 0.14 0.12 0.1 0.08 0.06 0.04 0.02 i f = 10ma i c = 1ma ? 30 100 90 80 70 60 50 40 30 20 10 0 ? 10 ? 20 fig.11 collector - emitter saturation voltage vs. ambient temperature 7 collector current i c (ma) collector-emitter voltage v ce (v) 0 40 0246810 t a = 25?c 30 20 10 p c (max.) i f = 7ma i f = 5ma i f = 3ma i f = 2ma i f = 1ma i f = 0.5ma fig.9 collector current vs. collector-emitter voltage current transfer ratio ctr (%) forward current i f (ma) 0.1 1 10 0 500 400 300 200 100 v ce = 5v t a = 25?c fig.8 current transfer ratio vs. forward current forward current i f (ma) 0.1 1 10 100 0 0.5 1 1.5 2 forward voltage v f (v) t a = 25?c t a = 75?c t a = 100?c t a = 50?c t a = 0?c t a = ? 25?c fig.7 forward current vs. forward voltage peak forward current i fm (ma) duty ratio 10 1 000 100 10 ? 2 10 ? 3 10 ? 1 1 pulse width 100 s t a = 25?c fig.6 peak forward current vs. duty ratio pc8141xnsz0f series
sheet no.: d2-a03702en remarks : please be aware that all data in the graph are just for reference and not for guarantee. 8 voltage gain a v (db) ? 25 5 0.1 1 10 100 1 000 frequency f (khz) v ce = 2v i c = 2ma t a = 25?c 0 ? 5 ? 10 ? 15 ? 20 r l = 10k ? 1k ? 100 ? fig.16 frequency response ambient temperature t a (?c) ? 30 100 90 80 70 60 50 40 30 20 10 0 ? 10 ? 20 v ce = 50v 10 ? 11 10 ? 5 10 ? 6 10 ? 7 10 ? 8 10 ? 9 10 ? 10 collector dark current i ceo (a) fig.12 collector dark current vs. ambient temperature load resistance r l (k ? ) 0.1 1 10 100 v ce =2v, i c =2ma 1 tf ts tr td 10 responce time ( s) fig.13 response time vs. load resistance (active region ) 10% input output input output 90% t s t d v cc r d r l t f t r please refer to the conditions in fig.13 and fig.14. v ce fig.15 test circuit for response time load resistance r l (k ? ) 1 1 10 100 1 000 v cc =5v, i f =1ma, t a =25?c 10 tf ts tr td 100 responce time ( s) fig.14 response time vs. load resistance (saturation region) collector-emitter saturation voltage v ce (sat) (v) forward current i f (ma) 0 5 0246810 t a = 25?c 4 3 2 1 i c = 7ma i c = 5ma i c = 3ma i c = 2ma i c = 1ma i c = 0.5ma fig.17 collector-emitter saturation voltage vs. forward current pc8141xnsz0f series
sheet no.: d2-a03702en design considerations while operating at i f <0.5ma, ctr variation may increase. please make design considering this fact. in case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through ired or current may change. if the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of ired. this product is not designed against irradiation and incorporates non-coherent ired. degradation in general, the emission of the ired used in photocouplers will degrade over time. in the case of long term operation, please take the general ired degradation (50% degradation over 5 years) into the design consideration. recommended foot print (reference) ? for additional design assistance, please review our corresponding optoelectronic application notes. 9 2.2 2.54 1.7 8.2 (unit : mm) design guide pc8141xnsz0f series
sheet no.: d2-a03702en manufacturing guidelines reflow soldering: reflow soldering should follow the temperature profile shown below. soldering should not exceed the curve of temperature profile and time. please don't solder more than twice. soldering method flow soldering : due to sharp's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. flow soldering should be completed below 270?c and within 10s. preheating is within the bounds of 100 to 150?c and 30 to 80s. please don't solder more than twice. hand soldering hand soldering should be completed within 3s when the point of solder iron is below 400?c. please don't solder more than twice. other notices please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and pcb varies depending on the tooling and soldering conditions. 10 pc8141xnsz0f series 1234 300 200 100 0 0 (?c) terminal : 260?c peak ( package surface : 250?c peak) preheat 150 to 180?c, 120s or less reflow 220?c or more, 60s or less (min)
sheet no.: d2-a03702en solvent cleaning: solvent temperature should be 45?c or below immersion time should be 3 minutes or less ultrasonic cleaning: the impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of pcb and mounting method of the device. therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. recommended solvent materials: ethyl alcohol, methyl alcohol and isopropyl alcohol in case the other type of solvent materials are intended to be used, please make sure they work fine in ac- tual using conditions since some materials may erode the packaging resin. cleaning instructions this product shall not contain the following materials. and they are not used in the production process for this product. regulation substances : cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ?ead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated di- phenyl ethers (pbde). presence of odc 11 pc8141xnsz0f series
sheet no.: d2-a03702en package specification 12 12.0 6.7 5.8 10.8 520 2 sleeve package package materials sleeve : hips (with anti-static material) stopper : styrene-elastomer package method max. 100pcs of products shall be packaged in a sleeve. both ends shall be closed by tabbed and tabless stoppers. the product shall be arranged in the sleeve with its primary side mark on the tabless stopper side. max. 20 sleeves in one case. sleeve outline dimensions (unit : mm) pc8141xnsz0f series
13 tape and reel package package materials carrier tape : ps cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions f k e i d j g b h h a c 5? max. dimensions list (unit : mm) a 16.0 0.3 b 7.5 0.1 c 1.75 0.1 d 8.0 0.1 e 2.0 0.1 h 10.4 0.1 i 0.4 0.05 j 4.2 0.1 k 5.1 0.1 f 4.0 0.1 g 1.5 + 0.1 ? 0 a c e g f b d dimensions list (unit : mm) a 330 b 17.5 1.5 c 100 1.0 d 13 0.5 e 23 1.0 f 2.0 0.5 g 2.0 0.5 pull-out direction [packing : 3 000pcs/reel] reel structure and dimensions direction of product insertion pc8141xnsz0f series sheet no.: d2-a03702en
?the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp's devices. ?contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufacturing locations are also subject to change without notice. ?observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: - -- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment - -- medical and other life support equipment (e.g., scuba). ?if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. ?this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. ?contact and consult with a sharp representative if there are any questions about the contents of this publication. 14 sheet no.: d2-a03702en important notices pc8141xnsz0f series [e186]

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